Challenges of Foam Control in Strong Acid Chemical Polishing Solutions, Chemi Tech Offers Efficient Defoamer Solutions

In the high-precision surface treatment of metal and semiconductor materials, strong acid chemical polishing solutions are crucial for achieving bright and smooth surfaces. However, significant amounts of fine and stable foam are easily generated during production stirring, recirculation filtration, and workpiece immersion. This foam not only reduces the effective tank volume, causing raw material waste, but also shields the workpiece surface, leading to uneven polishing, spots, or dull marks. In severe cases, it can even cause solution overflow, posing operational safety hazards and site cleaning challenges.

Common defoamers on the market often prove inadequate when faced with complex polishing solution systems containing strong acids, high temperatures, and surfactants. They may have slow defoaming speeds and short foam suppression times, requiring frequent additions. Alternatively, they may have poor stability, decomposing or separating in strong acids, thereby contaminating the bath and affecting the final polishing result. How to persistently and stably control foam without compromising the core performance of the polishing solution has become a common challenge for many process engineers.

Chemi Tech addresses this industry pain point by developing a series of high-performance defoamers specifically designed for strong acid chemical polishing systems. Our solution is based on in-depth research into the foaming mechanisms of polishing solutions. The products utilize specially modified polyether siloxane composite technology, enabling them to maintain extremely high chemical stability in strong acidic environments. Their molecular structure is meticulously designed with very low surface tension, allowing rapid spreading on foam films. By disrupting film elasticity and promoting liquid drainage, they achieve rapid foam collapse and suppression.

Specific application steps are clear and straightforward: First, during polishing solution preparation or replenishment, it is recommended to add Chemi Tech defoamer at a proportion of 0.05%-0.3% of the total tank volume. The addition point can be chosen at the initial stirring stage or in the middle of the recirculation pipeline, utilizing moderate mechanical force to aid uniform dispersion. Second, for online systems already generating foam, a small amount can be added directly to the foam aggregation area multiple times, observing the immediate defoaming effect. Our defoamers have broad compatibility and can stably coexist with various inorganic acids, oxidizers, and polishing additives without introducing impurity ions or affecting polishing rate and brightness.

We previously collaborated with an enterprise specializing in precision alloy component processing. This company continuously encountered foam overflow issues on a continuous production line using a phosphoric acid-based polishing solution, requiring shutdown for cleaning several times per shift, which impacted product yield. After introducing Chemi Tech's specifically recommended CT-218 defoamer, foam was observed to rapidly dissipate within tens of seconds upon initial addition. After 24 hours of continuous operation, only an extremely thin, negligible layer of microfoam remained on the solution surface, with no need for mid-process additions. This not only completely resolved the on-site foam overflow issue, restoring stable continuous production line operation, but also reduced polishing defect rates caused by foam by approximately seventy percent. The customer highly praised the uniformity and consistency of the polished surface.

Choosing Chemi Tech means choosing reliable productivity assurance. Our defoamer products are designed to help you overcome foam obstacles in strong acid chemical polishing, ensuring process stability and enhancing product quality and production efficiency.