High-build coatings are widely used in industrial anti-corrosion and construction projects, but blistering during application remains a common challenge. As a leading coating brand, Chemi Tech offers the following systematic solutions:
1. Root Cause Analysis
1. Poor substrate preparation: Residual moisture, oil, or rust reduces adhesion.
2. Rapid solvent evaporation: High temperatures cause trapped bubbles.
3. Inadequate mixing: Insufficient stirring leads to incomplete curing.
4. Excessive film thickness: Thick layers hinder solvent release.
2. Chemi Tech's Solutions
1. Substrate Treatment
- Clean surfaces with Chemi Tech cleaners (e.g., KMC series).
- Achieve Sa2.5-grade blast profile (40-70μm roughness).
2. Environmental Control
- Maintain ambient temperature at 15-30°C with RH <85%.
- Use slow-evaporating thinners (Diluent NT) in hot climates.
3. Application Techniques
- Apply multiple thin coats (max 150μm per layer).
- Opt for Chemi Tech airless spray systems (e.g., Xtreme 5000).
4. Defoamer Application
- Add 0.5%-1% Foamex 810 or KM-818 defoamer with low-speed agitation.
5. Quality Verification
- Monitor with wet-film gauges; evaluate bubbles per ASTM D714.
3. Technical Support
Chemi Tech provides on-site assistance. Submit application data via Website or call hotline for customized solutions.
By implementing these measures, blistering can be minimized effectively. Always conduct patch tests prior to full-scale application.