Water-based automotive baking paint faces sagging and pinhole defects during high-temperature curing (140-160°C) due to rapid water evaporation. A East China auto parts plant reported 18% pinhole occurrence on hoods, with rework costs consuming 15% of total coating expenses.
Chemi Tech's leveling agent KMP-229 employs three core technologies:
Dynamic tension control: Polar anchoring groups reduce substrate tension below 22mN/m for rapid spreading;
Thermal resistance: Withstands 180°C to prevent molecular degradation;
Microbubble suppression: Embedded defoaming segments block pinhole formation during baking.
Case: Auto Parts Plant Efficiency Breakthrough
Supplying door panels to German OEMs, this plant eliminated weld-seam pinholes and sagging after adopting KMP-229:
Process: 0.3% dosage in base coat, premixed with resin and aged 30 mins;
Results:
DOI increased from 85 to 93 with uniform gloss;
Pinholes reduced from 18% to 2%, sagging areas decreased 90%;
Baking time shortened 8%, boosting output 22%.
Now applied to EV battery case coating, solving wetting failures on aluminum alloy.