Chemi Tech PCB Defoamer: Precision Terminator of Micron-Level Bubbles

In the electroless copper plating workshop of an electronics manufacturer in Southern China, Engineer Li inspected a substrate riddled with cobweb-like pores under a magnifier. These bubbles smaller than 50 microns lurked like saboteurs, compromising the conductive layer's integrity. \This is the third batch of prototypes scrapped due to bubbles this month,\ he rotated the board under light, watching rainbow haloes refract through the trapped gas - telltale signs of impending failure.

Known as \fish eyes\ in the industry, these defects breed silently beneath seemingly calm chemical baths. Traditional mechanical defoaming couldn't capture sub-micron bubbles, while excessive agitation damaged solution efficacy. When production supervisor Wang introduced Chemi Tech's PCB Defoamer into the tank, the pale blue liquid formed a molecular-level spread across the surface. Within 24 hours, microscopic comparison revealed a 92% reduction in bubble density, with metal deposition layers showing mirror-smooth cross-sections.

Chemi Tech's R&D team engineered a triple-action defoaming system through reconstructed organosilicon polymer frameworks: hydrophobic particles puncture bubble walls, polyether chains suppress foam regeneration, and specialized siloxanes create dynamic surface barriers. In a high-density interconnect board facility, adding merely 0.15‰ of the defoamer reduced plating void defects from 1.8% to 0.3%. Crucially, compatibility tests with acidic copper plating solutions extended chemical lifespan by 40 production cycles.

\Bubble elimination isn't just a technical parameter - it determines the fate of precision circuits,\ Supervisor Wang noted in his quarterly report. When filling 0.05mm laser-drilled blind vias with copper pillars, Chemi Tech's defoamer molecules form nano-scale protective films on hole walls, ensuring uniform copper ion deposition. This microscopic intervention is now pushing first-pass yield for 5G communication boards beyond the 99.2% threshold.