Semiconductor Cleaning Defoamer Solution - Chemi Tech Expert Foam Control

Foam formation during semiconductor cleaning processes often leads to wafer surface residues, reduced efficiency, and equipment contamination. Conventional defoamers may introduce impurities or lack stability, impacting chip performance and yield.  

Chemi Tech focuses on developing semiconductor-grade defoamers with core solutions:  

1. Low-foam formulation: Utilizes high-purity polyether-modified siloxane materials, compatible with acid/alkaline cleaning systems for rapid foam collapse without residue;  

2. Process adaptability: Matches ultrasonic and spray cleaning methods through dynamic foam testing and line simulation to minimize foam recurrence;  

3. Enhanced stability: Resists high temperatures and electrolytes, preventing failure under environmental fluctuations;  

4. Technical guidance: Provides full-process support from dosage ratios to injection points and circulation systems.  

A wafer fabrication client experienced 15% productivity loss due to foam overflow in cleaning tanks during advanced processes. Chemi Tech analyzed cleaner composition and parameters, recommending customized defoamer KM-288 series. Implementation achieved 99% foam control, reduced cleaning cycle time by 20%, and contact angle tests confirmed no hydrophobic residues. The client has maintained orders for 12 months.  

Chemi Tech defoamers pass particle and ionic contamination tests,  Request free samples or technical proposals by contacting our engineering team.