PCB Ink Defoamer Selection Guide: Chemi Tech's High-Efficiency Solution

During PCB ink manufacturing, foam formation critically impacts the precision and surface quality of printed circuit boards. Chemi Tech addresses this challenge with specialized PCB ink defoamers, utilizing unique molecular structures for rapid bubble collapse and long-term foam suppression.  

Key Technical Advantages  

1. Instant Defoaming: Penetrates bubble interfaces within 5 seconds during mixing or coating, eliminating defects like pinholes.  

2. Chemical Resistance: Compatible with epoxy and acrylic systems, maintaining stable impedance during high-temperature curing.  

3. Cost Efficiency: Effective at 0.1%-0.5% dosage, reducing material costs in screen/inkjet printing processes.  

Application Scenarios  

- Solder Mask Inks: Prevents bubble-induced exposure failures in developing stages.  

- Legend Printing: Enhances edge definition of markings.  

- Conductive Inks: Minimizes bubble interference with circuit conductivity.  

Chemi Tech offers customized formulations for high-aspect-ratio blind via inks. Lab tests show over 20% improvement in leveling performance, significantly reducing rework rates.