Chemi Tech Dispersants Solve Solid in Photoresist

In photoresist manufacturing, the dispersion uniformity of solid particles such as photoinitiators and pigments directly impacts film formation quality and photocuring efficiency. Chemi Tech’s specialized dispersants utilize unique molecular design to reduce particle surface energy and prevent agglomeration. The mechanisms include:

Anchoring group adsorption: Polar groups tightly encapsulate particle surfaces, forming a steric hindrance layer that minimizes Van Der Waals force forces between particles.

Solvation chain extension: Extended chains in resin systems maintain dispersion stability, suppressing sedimentation during high-speed stirring and long-term storage.

Photoresist Application Case:

A semiconductor photoresist manufacturer applied Chemi Tech dispersants to nano-scale photoinitiators (particle size ≤200 nm). Results showed:

Particle size distribution standard deviation decreased to ±15 nm (from ±50 nm);

Photocuring efficiency increased by 30% due to enhanced UV absorption consistency;

Lithography line edge roughness (LER) reduced to below 5 nm, meeting DUV lithography precision requirements.

Technical Advantages:

Broad compatibility: Suitable for acrylic, epoxy, and other mainstream photoresist systems;

Low dosage: Only 0.5–2 wt% required for long-term dispersion;

Thermal stability: Maintains performance during photoresist baking (80–120℃).