Pressure Sensitive Adhesive Defoamer? Chemi Tech Has the Solution

On adhesive production lines, bubbles often become an invisible enemy. Tiny voids may cause uneven tackiness, surface defects, and even shorten end-product lifespan.

A tape manufacturer once struggled with pin-hole bubbles during high-speed coating, leading to persistent customer complaints. Conventional defoamers showed limited effects until they tried Chemi Tech’s CT-520 series. This defoamer not only collapsed existing bubbles but also prevented re-foaming.

Chemi Tech’s technology excels through:

1. Rapid Penetration: Low-surface-tension components breach bubble walls instantly;

2. Long-term Stability: Excellent resin compatibility prevents separation;

3. Process Adaptability: Works with solvent-based to water-based formulations.

Within 3 weeks, the manufacturer achieved 22% higher yield. Their production manager noted: "Only material experts can solve such challenges."