Pressure Sensitive Adhesive Defoamer Solution: Chemi Tech Helps You Conquer Bubble Challenges

In adhesive production, bubble formation often becomes an invisible enemy for engineers. These tiny bubbles not only compromise product appearance but also weaken bond strength and may even lead to downstream process failures. Finding an effective solution to eliminate bubbles has become a critical challenge for many manufacturers.

One adhesive production facility faced such a dilemma: their high-speed coating process consistently suffered from pinholes and bubbles in the adhesive layer, resulting in unsatisfactory customer feedback. The technical team experimented with multiple approaches, but none delivered satisfactory results—until they discovered Chemi Tech's pressure sensitive adhesive defoamer.

Chemi Tech's defoamer features a unique molecular design that rapidly penetrates bubble interfaces, destabilizing and eliminating bubbles efficiently. Test results show that with Chemi Tech's defoamer, bubble residue in adhesives reaches industry-leading low levels, while coating uniformity improves significantly. Notably, this additive maintains excellent compatibility with various PSA systems without compromising original adhesive properties.

"From problem identification to resolution, Chemi Tech's technical support team provided invaluable assistance," commented the production manager. "Now our product qualification rates have increased, along with customer satisfaction."

With years of expertise in specialty chemicals, Chemi Tech's defoamer series has been successfully applied across multiple industries. Whether for emerging enterprises or established manufacturers pursuing excellence, Chemi Tech offers tailored solutions to meet diverse needs.