How to Solve Adhesive Defoaming Challenges? Chemi Tech Eliminates Bubble Troubles

In the production facility of an electronic encapsulation materials enterprise in southern China, engineers faced a persistent challenge lasting weeks: whenever high-temperature adhesive was injected into precision components, countless tiny bubbles emerged like mischievous sprites, leaving speckled defects on the cured product surface. These high-value electronic components were rejected by clients due to appearance flaws, casting a pall of anxiety over the production line.

Technical Director Mr. Wang tried various conventional methods: adjusting temperature, altering injection speed, even changing raw material suppliers—yet those stubborn bubbles remained unchanged. Until one Tuesday night, a deep blue sample container bearing the Chemi Tech logo appeared on the experimental bench.

This was a specialized defoamer newly developed by Chemi Tech's R&D team. Unlike conventional defoamers that simply burst bubbles, it featured a multi-layer molecular design—hydrophobic particles precisely punctured bubble films while polyether chains rapidly spread to form a protective layer. Like trained bomb disposal experts, it instantly dismantled foam structures while preventing new bubble formation.

After 72 hours of continuous testing, a miracle occurred: adhesive flow rate increased by 20%, while product yield jumped from 67% to 98.3%. Under microscopy.

At Chemi Tech, innovation never ceases. We believe every bubble holds technological mysteries worth exploring. When you face adhesive foam challenges, proven solutions are always here awaiting your discovery.