Epoxy Resin Defoaming Solution - Chemi Tech Efficient Defoamer Guide

Epoxy resin tends to generate micron-sized bubbles during curing, leading to surface defects, reduced mechanical properties, and compromised dielectric characteristics. Traditional physical defoaming methods suffer from low efficiency and limited applicability.

Chemi Tech's chemical defoamers operate at molecular level to rapidly reduce bubble surface tension in resin systems, promoting bubble coalescence and directional migration to the surface for rupture. The solution involves three phases: First, adding 0.1%-0.5% of KM-101 series antifoaming agent during mixing to prevent air entrapment; second, incorporating KM-203 series defoaming agent before casting to achieve rapid bubble escape through selective wetting; finally, implementing a graded heating process to control staged viscosity changes.

Practical applications demonstrate that an electronic encapsulation enterprise reduced bubble defect rates from 25% to below 3% while increasing flexural strength by approximately 18%. After two weeks of process adaptation, the production line achieved continuous stable operation.

Chemi Tech offers full-process technical support, customizing defoaming solutions based on clients' specific material systems to ensure chemical compatibility. All products undergo high-temperature stability and aging performance tests to prevent subsequent phase separation or yellowing issues.