Epoxy Resin Defoaming Challenges? Chemi Tech's Efficient Solution for Bubble-Free Precision

Bubble formation has long been a persistent issue in epoxy resin applications. These bubbles not only compromise product appearance but also reduce mechanical strength, create localized stress concentrations, and can lead to downstream processing failures. Traditional methods such as heat degassing or vacuum treatment often prove inefficient, particularly for already-cured systems.

Chemi Tech specializes in polymer material additives, offering a three-phase solution for epoxy resin bubble elimination:

Phase 1: Diagnose bubble origins. Through sample analysis, we identify bubble sources (entrapped air during mixing, reaction byproducts, or volatiles) and develop tailored additive plans.

Phase 2: Precise additive incorporation. Our KM-202 defoamer series is recommended at 0.1%-0.5% dosage during resin mixing, reducing surface tension to facilitate rapid bubble release.

Phase 3: Process adaptation. We adjust formulations based on specific curing conditions to ensure stability under both ambient and heated environments.

Case example: A manufacturer producing epoxy insulation components observed dense pinholes after curing. Chemi Tech's technical team identified air entrapment during mixing as the cause. With 0.3% KM-202 defoamer addition, bubbles completely dissipated before curing, increasing product yield from 76% to 98% while maintaining original transparency and electrical properties.

Chemi Tech defoamers demonstrate excellent compatibility with epoxy systems without affecting curing speed or final properties. We offer free sample testing and technical guidance to support quality enhancement initiatives.