In high-end consumer electronics coatings, micron-level bubbles causing pinholes and craters are critical yield killers. For example, in smartphone touchscreen coatings, traditional defoamers fail to suppress micro-bubbles during high-speed spraying and high-temperature curing, leading to reduced transmittance and surface irregularities. Chemi Tech's specialized defoamer achieves breakthroughs through modified polysiloxane and precision emulsification:
High-Temperature Stability – Maintains activity at 80°C–120°C, preventing failure due to thermal fluctuations;
Ultra-Thin Coating Compatibility – Eliminates micro-bubbles in ≤10μm UV-cured coatings without leveling defects;
High-Speed Dispersion – Compatible with 3,000rpm+ spraying equipment, achieving bubble rupture within 30 seconds (tested defoaming rate >50mL/s).
Case Study: A leading smartphone manufacturer faced 87% yield due to micro-bubbles in metal frame nano-coatings. After adopting Chemi Tech's solution:
Coating line bubble residue decreased by 92%, pinhole defects dropped to 0.3/㎡;
Foam inhibition stability extended to 96 hours in continuous 90°C production lines;
Yield surpassed 99%, saving over ¥6M annually in rework costs.
This technology is now applied in foldable screen hinge coatings and lens anti-glare films, enabling "zero-defect" coating processes.