On adhesive production lines, bubbles often become an invisible enemy. Tiny voids may cause uneven tackiness, surface defects, and even shorten end-product lifespan.
A tape manufacturer once struggled with pin-hole bubbles during high-speed coating, leading to persistent customer complaints. Conventional defoamers showed limited effects until they tried Chemi Tech’s CT-520 series. This defoamer not only collapsed existing bubbles but also prevented re-foaming.
Chemi Tech’s technology excels through:
1. Rapid Penetration: Low-surface-tension components breach bubble walls instantly;
2. Long-term Stability: Excellent resin compatibility prevents separation;
3. Process Adaptability: Works with solvent-based to water-based formulations.
Within 3 weeks, the manufacturer achieved 22% higher yield. Their production manager noted: "Only material experts can solve such challenges."