Chemi Tech Defoamer: Ending Foam Challenges in Circuit Board Cleaning

In a precision electronic module manufacturing facility in Southern China, Engineer Li stared anxiously at the cleaning tank. Surging foam formed stubborn barriers, trapping micro-etch residues that persistently clung to the micro-vias of circuit boards. Amid the roar of ultrasonic cleaners, operators repeatedly halted production to wipe tank walls—the delivery timeline for these high-density communication modules was silently consumed by invisible foam.

This real-world scenario was captured by Chemi Tech's technical team during deep factory investigations. The limitations of conventional defoamers in precision electronics cleaning were evident: insufficient foam control left cleaning blind spots, while residues caused subsequent soldering defects. We recognized that the battle against foam on circuit boards fundamentally required molecular-level precision.

After 17 months of formulation攻坚, Chemi Tech's next-generation electronic-grade defoamer achieved a breakthrough. Its core lies in triple synergistic mechanisms: specialty polyether structures enable instant foam film rupture, silicone-modified components suppress micro-bubble regeneration, and proprietary charge-neutralization technology blocks contaminant re-adsorption. In trials at a Jiangsu electronics manufacturer, foam height in cleaning tanks remained consistently below 3cm, micro-via blockage rates decreased by 62%, and third-party tests confirmed compliance with stringent ionic residue requirements for precision components.

Today, when Engineer Li's team adopts the pre-dosing protocol—infusing Chemi Tech defoamer at 0.3%-0.8% concentration into the cleaning agent circulation system—the continuously running production line no longer experiences foam overflow emergencies. Metal contacts shine like mirrors, ceramic substrate pores remain unobstructed, and yield curves finally stabilize. This signifies not just the disappearance of foam, but the reclaiming of process control. Chemi Tech safeguards absolute connectivity in electronic pathways through molecular innovation.